Topic
Industry sector making wafer fabrication equipment—lithography, deposition, etch, and metrology tools—used to manufacture semiconductor chips.
Chinese startup Langdao Silex displayed a laser-produced-plasma EUV source rated above 15W with 90% domestic components, Tom's Hardware reported. TrendForce, citing various sources, says commercializing it needs another three to five years.
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Besi shares fell 3% to 158.50 euros after SemiAnalysis read 27 ASML patent filings as evidence of a hybrid bonding tool. ASML has not confirmed the tool, so the market is pricing a patent count.
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ASML said on Oct 14 that its 2027 and 2028 supply will not fully meet demand even after planned 30% capacity increases in both years. Some customers are also asking to order for 2029 and 2030, which ASML calls interest, and it gave no count or value.
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Seoul's KOSPI fell 0.44% to 6,008.81 on Oct. 14, its sixth straight daily loss and 14.21% below its Oct. 2 close. Yonhap tied the reversal of a morning gain to ASML, yet that session supplied only 2.7% of the 994.93 points lost.
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Hanwha Semitech earned 2.5 billion won of operating profit in the first half, short of its 4.2 billion won interest expense. Non-chip lines are still 82% of sales, so further parent funding turns on orders for hybrid bonders and deposition tools.
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Korea's KOSDAQ rose 4.24% this month through Oct. 11 while the KOSPI fell 3.1%, Korea Exchange figures show. Seoul Economic Daily reported that the buying is concentrated in chip materials and equipment suppliers, so anyone buying the small-cap index is holding a narrow bet on chip spending.
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The toolmaker will spend more than $3 billion over five years to push experiment capacity past 1.5 million runs a year. Its named customers are the three largest memory makers.
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Modi said India has moved past policy and plant construction into commercial chip production. The fresh investment announced at Semicon India 2026 came from two equipment suppliers, Applied Materials and Lam Research.
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The Dutch company stamps out waveguides for smart glasses and now wants to supply data center optics, a market where it has not installed a machine. Its backers include 3M Ventures and the European Investment Bank.
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Tokyo Electron Korea will test the tools it sells SK hynix in its own matching clean room a kilometre from the customer's Yongin site, on a completion date the customer has already moved once. Kolon Global is the builder.
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Logic vendors have made copper-to-copper bonding routine. Memory has not, because HBM has to place pre-tested dies one at a time. A relaxed stack-height rule let HBM4 skip the switch entirely.
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Copper-to-copper slips to HBM5 at the earliest, so HBM4E capacity has to come out of die thickness inside a 775-micron package. iHBM heat blocks cannot be retrofitted to parts already in design.
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The company promises about 80 percent gross and 75 percent operating margins through fiscal 2030 plus all excess cash back. Contracted volume, not scarcity talk, is the mechanism.
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